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MAX6605MXK Rev. A
RELIABILITY REPORT FOR MAX6605MXK PLASTIC ENCAPSULATED DEVICES
June 4, 2002
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX6605 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The MAX6605 precision, low-power, analog output temperature sensor is available in a 5-pin SC70 package. The device has a +2.7V to +5.5V supply voltage range and 10A supply current over the -55C to +125C temperature range. For the -40C to +105C temperature range, the supply voltage can go as low as +2.4V. Accuracy is 1C at TA = +25C and 3C from 0C to +70C. The MAX6605 output voltage is dependent on its die temperature and has a slope of 11.9mV/C and an offset of 744mV at 0C. The output typically shows only +0.4C of nonlinearity over the -20C to +85C temperature range.
B. Absolute Maximum Ratings Item VCC to GND OUT,A,B to GND Current into Any Pin Output Short-Circuit Duration VCC Rise or Fall rate Maximum Current (Input/Output) Operating Temperature Range Storage Temp. Lead Temp. (10 sec.) Continuous Power Dissipation (+70C) 5-Pin SC70 Derates above +70C 5-Pin SC70 Rating -0.3V to +6V -0.3V to (VCC+0.3V) 10mA Continuous 0.05V/uS 20mA -55C to +125C -65C to +150C +300C 245mW 3.1mW/C
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Low-Power Analog Temperature Sensor S8 573 California, USA Malaysia or Philippines November, 2000
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: 5-Lead SC70 Alloy 42 Solder Plate Silver-Filled Epoxy Gold (1 mil dia.) Epoxy with silica filler Buildsheet # 05-2901-0003 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 31 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Copper/Si None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 192 x 4389 x 80 x 2 (Chi square value for MTTF upper limit)
Temperature Acceleration factor assuming an activation energy of 0.8eV = 13.57 x 10-9 = 13.57 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The attached Burn-In Schematic (Spec. # 06-5603) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The TS07 die type has been found to have all pins able to withstand a transient pulse of 2500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that t is device h withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX6605MXK
TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
80
0
DC Parameters & functionality
100
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic package/process data.
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKE T
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B Mil Std 883D Method 3015.7 Notice 8
R = 1.5k C = 100pf
TERMINAL D

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